Method for manufacturing heat dissipation device

ABSTRACT

A method for manufacturing a heat dissipation device is disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed and manufactured in a more flexible manner.

This application claims the priority benefit of U.S. provisionalapplication No. 62/598,134 filed on Dec. 13, 2017.

FIELD OF THE INVENTION

The present invention relates to a method for manufacturing a heatdissipation device, and more particularly, to a method for manufacturinga heat dissipation device layer by layer.

BACKGROUND OF THE INVENTION

The currently available electronic apparatus have constantly upgradedperformance, and, as a result, heat produced by the electronic elementsin the electronic apparatus, particularly the electronic elements forsignal processing and data computation, is much higher than thatproduced by the electronic elements in the conventional electronicapparatus. There are various heat dissipation devices available forremoving the produced heat from the electronic elements. Among others,heat pipes, heat radiators and vapor chambers are the most frequentlyused heat dissipation devices, because they are in direct contact withthe heat-producing electronic elements to provide further enhanced heatdissipation effect and effectively prevent the electronic elements frombeing burned out due to overheat.

Vapor chamber, heat pipe, and loop heat pipe are the most commonly usedheat dissipation devices, all of which internally define a vacuum-tightchamber, in which vapor-liquid circulation of a working fluid occurswith the aid of a wick structure provided in the chamber, so as toachieve a heat transfer effect.

More specifically, either the vapor chamber or the heat pipe achieves aheat exchange effect when the working fluid in the vacuum-tight chamberevaporates and condenses alternatively. Since the use of the heat pipeor the vapor chamber is largely restricted by the space in which thevapor chamber or the heat pipe is installed, most of the currentlyavailable heat pipes and vapor chambers are manufactured to nominalsizes with limited shapes and dimensions and are therefore relativelyinflexible in use.

However, the conventional vapor chamber is formed by closing two platemembers to each other and sealing joints between them, so that anairtight chamber is defined in the completed vapor chamber; and theconventional heat pipe has two sealed ends to internally define anairtight chamber. The airtight chamber of the vapor chamber and the heatpipe is then evacuated to produce a vacuum state therein and filled witha working fluid. In the process of manufacturing the vapor chamber andthe heat pipe, a defective joint sealing procedure often leads to poorair-tightness and vacuum leakage of the completed vapor chamber and heatpipe. Further, edge portions/end portions reserved on the vaporchamber/the heat pipe for forming the sealed joints of the vapor chamberand the sealed ends of the heat pipe form ineffective zones that do notprovide any space for the working fluid to work to therefore cause wasteof material and increased manufacturing cost.

According to the conventional vapor chamber and heat pipe manufacturingmethod, different apparatus must be purchased for independentlyproducing individual structural units for forming a complete vaporchamber and a heat pipe, such as the upper and lower plate members forthe vapor chamber and the outer pipe for the heat pipe. Subsequentproduction can be started only after these individual structural unitsare produced. Further, at least one wick structure, such as apowder-sintered body, a woven mesh or a plurality of grooves, is to beprovided in the airtight chamber of the vapor chamber and the heat pipe.In this case, at least one processing procedure, such as sintering,welding, diffusion bonding, knurling or laser processing, must beperformed on the inner wall surfaces of the airtight chamber to providethe wick structure. In the case of a wick structure in the form of awoven mesh, it might not be easily tightly attached to the inner wallsurfaces of the airtight chamber to therefore cause the problem of poorcapillary force of the wick structure. Further, since the conventionalvapor chamber is a structure formed of two superimposed plate members,its design and production is subjected to many restrictions andcomplicated manufacturing steps.

In summary, in the conventional vapor chamber and heat pipemanufacturing method, individual basic structural elements must beseparately manufactured and then assembled together, or must beprocessed before being assembled together. However, inaccurate ordefective assembling or sealing of these individual basic structuralelements tends to cause poor joints or leaked airtight chamber andaccordingly, defective products of vapor chambers and heat pipes.

It is therefore tried by the inventor to overcome the drawbacks ofconventional heat dissipation devices.

SUMMARY OF THE INVENTION

A primary object of the present invention is to overcome the drawbacksof the conventional heat dissipation devices by providing a heatdissipation device that can be more flexibly designed while ensuresabsolute air tightness thereof.

To achieve the above and other objects, a first embodiment of the heatdissipation device provided according to the present invention includesa first basic structural body having a wick structure formed on one sidesurface thereof, and the first basic structural body and the wickstructure are integral structural bodies formed layer by layer.

To achieve the above and other objects, a second embodiment of the heatdissipation device provided according to the present invention includesa plurality of first basic structural bodies respectively having a wickstructure formed on one side surface thereof, and the first basicstructural bodies and the wick structures are structures formed layer bylayer. The first basic structural bodies are fixedly closed together inpairs to construct a desired heat dissipation device that internallydefines an airtight chamber, and a working fluid is filled in theairtight chamber.

The first basic structural body and the wick structure can be formedusing gold, silver, copper, aluminum, titanium, stainless steel,ceramic, non-metal materials, or any combination thereof.

To achieve the above and other objects, the present invention alsoprovides a method for manufacturing a heat dissipation device. Accordingto a preferred embodiment of the method for manufacturing the heatdissipation device, the following steps are included:

S1: forming a first basic structural body layer by layer for constructeda desired heat dissipation device;

S2: forming a wick structure on one side surface of the first basicstructural body and forming all remaining structural portions forconstructing the desired heat dissipation device; and

S3: performing evacuation, working fluid filling and final sealingprocesses for the constructed heat dissipation device.

Since the heat dissipation device according to the present invention isformed layer by layer in a special manufacturing manner, it can be moreflexibly designed. The flexibly designed heat dissipation device of thepresent invention not only solves the disadvantages in the conventionalheat dissipation devices caused by the joint sealing process, but alsolargely reduces the procedures and time needed in manufacturing theconventional heat dissipation devices while enables firm attachment ofthe wick structure to the inner wall surfaces of the heat dissipationdevices. In summary, the present invention enables upgraded overallflexibility in designing and manufacturing a heat dissipation device.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present inventionto achieve the above and other objects can be best understood byreferring to the following detailed description of the preferredembodiments and the accompanying drawings, wherein

FIGS. 1a to 1d are perspective views showing the forming of a firstembodiment of a heat dissipation device according to the presentinvention;

FIGS. 2a to 2c are perspective views showing the forming of a secondembodiment of the heat dissipation device according to the presentinvention;

FIG. 2d is an assembled sectional view of the heat dissipation device ofFIGS. 2a to 2 c;

FIG. 3 is an assembled perspective view of a third embodiment of theheat dissipation device according to the present invention;

FIG. 4 is an assembled sectional view of a fourth embodiment of the heatdissipation device according to the present invention;

FIGS. 5a to 5g are perspective views showing the forming of a fifthembodiment of the heat dissipation device according to the presentinvention;

FIGS. 6a and 6b are perspective views showing the forming of a sixthembodiment of the heat dissipation device according to the presentinvention;

FIGS. 7a and 7b are perspective views showing the forming of a seventhembodiment of the heat dissipation device according to the presentinvention;

FIG. 8 is an assembled perspective view of an eighth embodiment of theheat dissipation device according to the present invention;

FIG. 9a is a perspective view of a ninth embodiment of the heatdissipation device according to the present invention;

FIG. 9b is a top view of the ninth embodiment of the heat dissipationdevice according to the present invention;

FIG. 9c is a sectional side view of a first variation of the ninthembodiment of the heat dissipation device according to the presentinvention;

FIG. 9d is a sectional side view of a second variation of the ninthembodiment of the heat dissipation device according to the presentinvention;

FIG. 9e is a sectional side view of a third variation of the ninthembodiment of the heat dissipation device according to the presentinvention;

FIG. 10a is a sectional side view of a tenth embodiment of the heatdissipation device according to the present invention;

FIG. 10b is another sectional side view of the tenth embodiment of theheat dissipation device according to the present invention;

FIG. 11 is a flowchart showing the steps included in a first embodimentof a method for manufacturing the heat dissipation device according tothe present invention;

FIG. 12 is a flowchart showing the steps included in a second embodimentof the method for manufacturing the heat dissipation device according tothe present invention;

FIG. 13 is a flowchart showing the steps included in a third embodimentof the method for manufacturing the heat dissipation device according tothe present invention;

FIG. 14 is a flowchart showing the steps included in a fourth embodimentof the method for manufacturing the heat dissipation device according tothe present invention;

FIG. 15 is a flowchart showing the steps included in a fifth embodimentof the method for manufacturing the heat dissipation device according tothe present invention;

FIG. 16 is a flowchart showing the steps included in a sixth embodimentof the method for manufacturing the heat dissipation device according tothe present invention;

FIG. 17 is a flowchart showing the steps included in a seventhembodiment of the method for manufacturing the heat dissipation deviceaccording to the present invention;

FIG. 18 is a flowchart showing the steps included in an eighthembodiment of the method for manufacturing the heat dissipation deviceaccording to the present invention;

FIG. 19 is a flowchart showing the steps included in a ninth embodimentof the method for manufacturing the heat dissipation device according tothe present invention;

FIG. 20 is a flowchart showing the steps included in a tenth embodimentof the method for manufacturing the heat dissipation device according tothe present invention; and

FIGS. 21a to 21d and FIGS. 22a to 22d are pictorial illustrations of thesteps included in the tenth embodiment of the method for manufacturingthe heat dissipation device according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferredembodiments thereof and by reference to the accompanying drawings. Forthe purpose of easy to understand, elements that are the same in thepreferred embodiments are denoted by the same reference numerals.

The present invention provides a heat dissipation device having anintegral structure constructed layer by layer or part by part based onthe concept of creating something from zero. This type of manufacturingis implemented mainly through 3D printing, electrochemical processing,printing, thermal spraying, or any combination thereof. For thispurpose, a primary fundamental carrier or member is first formed, andother secondary structural parts or structural bodies are thensequentially formed on the primary fundamental carrier or member lay bylayer to finally form an integral structure.

Please refer to FIGS. 1a to 1 d, which are perspective views showing theforming of a first embodiment of the heat dissipation device accordingto the present invention. In the first embodiment, a member serving asthe primary fundamental carrier/member is a lower plate member of avapor chamber, which is referred to as a/the first basic structural bodyand generally denoted by reference numeral 1 herein. There is a wickstructure 2 formed on one side surface of the first basic structuralbody 1. The first basic structural body 1 and the wick structure 2 arestructural bodies formed layer by layer.

Please refer to FIG. 1 a. The first basic structural body 1 is astructure formed layer by layer. Forming the structure layer by layercan be achieved through 3D printing, electrochemical processing,printing or thermal spraying. In the first embodiment, the first basicstructural body 1 is illustratively and non-restrictively formed layerby layer through 3D printing. Further, the first basic structural body 1can be formed of a metal material, a non-metal material, or acombination thereof. In the case of the metal material, it can be gold,silver, copper, aluminum, titanium, stainless steel, or an alloythereof. In the case of the non-metal material, it can be plastic orceramic. The finally formed first basic structural body 1 is shown inFIG. 1 b. Further, the first basic structural body 1 can include agrooved structure (not shown) directly formed on an inner side surfacethat is to serve as an inner wall surface of the vapor chamber.

Please refer to FIG. 1 c. The wick structure 2 is formed on the innerside surface of the first basic structural body 1 layer by layer, too.More specifically, the wick structure 2 can be a structural layerconsisting of one single porous body or a structural layer consisting ofa plurality of superimposed porous bodies achieved through any one of 3Dprinting electrochemical processing, printing, and thermal spraying. Theporous body can be a powder-sintered body, a woven mesh, a fibrousmember, or a structural body combining superimposed layers ofpowder-sintered body, woven mesh and fibrous member.

Please refer to FIG. 1 d. After forming the first basic structural body1 layer by layer and then forming the wick structure 2 on the firstbasic structural body 1 also layer by layer, a plate member for one sideof the vapor chamber (i.e. a lower plate member or an upper plate memberof the vapor chamber) is finally formed.

The titanium material for forming the first basic structural body 1 canbe commercially pure titanium or a titanium alloy, both of which arecharacterized by the following nine advantages of high specificstrength, good corrosion resistance, low elastic modulus, good heatresistance, good low-temperature performance, high biocompatibility, lowheat transfer coefficient, colorful oxide film and being non-magnetic,and have been widely applied to livelihood-related industry,petrochemical industry, aerospace industry, military industry andmedical industry. Up to date, there are already more than 100 types oftitanium alloys that have been developed by different countries in theworld, and about 40 to 50 types of these titanium alloys have alreadybecome commercialized. According to other chemical elements containedtherein, these titanium alloys can be generally classified into threemajor categories, namely, alpha (α) alloys, alpha and beta (α-β) alloys,and beta (β) alloys. According to the types and contents of differentchemical elements contained therein, alpha titanium alloys can befurther classified into commercially pure titanium, alpha titaniumalloys and near-alpha titanium alloys. Commercially pure titanium doesnot contain other chemical elements but only a trace amount of oxygen,carbon, nitrogen, hydrogen and iron. The oxygen in the pure titanium isan interstitial element, and the amount of oxygen contained in the puretitanium has a relatively big influence on the strength of the puretitanium. Generally speaking, the strength of titanium will increase100˜120 mPa (megapascal) when the content of oxygen in the titanium isincreased by 0.1 wt %. According to the oxygen content thereof, thecommercially pure titanium can be classified into four grades, namely,Grade 1 to Grade 4. The Grade 1 pure titanium has oxygen content lowerthan 0.18 wt % and the advantages of low strength, good ductility andgood formability, and is primarily used as a material for roofing andplate-type heat exchanger. The Grade 2 pure titanium has a tensilestrength ranged between 350 and 450 mPa, and is the most frequently usedone among the four grades of pure titanium, mainly used in themanufacture of seamed or seamless pipes and chemical tanks andcontainers. The Grade 3 pure titanium has a strength ranged between 500and 600 mPa and is mainly used in the manufacture of pressure chemicaltanks and containers. The Grade 4 pure titanium has a strength close to700 mPa and is the strongest one of the four grades of pure titanium,and is mainly used in the manufacture of some fasteners and relativelycomplicate parts that have to be formed around 300° C. Alpha titaniumalloys contain alpha stabilizers, such as aluminum and oxygen, as wellas neutral alloying elements, such as tin and zinc. Alpha titaniumalloys having been subjected to annealing has a single-phase alphastructure that has good structural stability, heat resistance andweldability, as well as a metal strength higher than that ofindustrially pure titanium. To satisfy the requirement for strength,neutral elements are added to the alpha titanium alloys to increasetheir strength. A typical example of the strengthened alpha titaniumalloys is Grade 6 titanium alloy, also known as Ti-5Al-2.5Sn, which hasgood fracture toughness and thermal strength at both room temperatureand high temperature, and has a long-term working temperature about 500°C. Further, a low interstitial Ti-5Al-2.5Sn can be used in alow-temperature environment. As having been mentioned above, both thecommercially pure titanium and the titanium alloys have the advantagesof high specific strength, good corrosion resistance, low elasticmodulus, good heat resistance, good low-temperature performance, highbiocompatibility, low heat transfer coefficient, colorful oxide film andbeing non-magnetic. Therefore, different types of pure titanium ortitanium alloys can be selected for manufacturing different portions ofa loop heat pipe. That is, by using pure titanium and titanium alloys ofdifferent properties to replace the use of copper, aluminum or stainlesssteel that are conventionally used in the manufacture of loop heatpipes, it is able to advantageously largely upgrade the overall heatdissipation efficiency and structural strength of the loop heat pipeswhile largely reduce the overall weight thereof.

Please refer to FIGS. 2a to 2c , which are perspective views showing theforming of a second embodiment of the heat dissipation device accordingto the present invention; and to FIG. 2d , which is an assembledsectional view of the heat dissipation device of FIGS. 2a to 2c . Sincethe second embodiment is partially structurally similar to the firstembodiment, portions of the second embodiment that are the same as thefirst embodiment are not repeatedly described herein.

The heat dissipation device in the second embodiment is generallydenoted by reference numeral 3, and, as shown in FIG. 2a , is mainlymanufactured using a plurality of first basic structural bodies 1, whichare formed layer by layer as described in the first embodiment. As shownin FIG. 2b , two pieces of first basic structural bodies 1 arecorrespondingly closed together to construct a heat dissipation device3, which is shown in FIG. 2 c.

The heat dissipation device 3 constructed by correspondingly closing twopieces of first basic structural bodies 1 together internally defines anairtight chamber 31, in which a wick structure 2 and a working fluid 4are provided.

Please refer to FIG. 3, which is an assembled perspective view of athird embodiment of the heat dissipation device according to the presentinvention. Since the third embodiment is partially structurally similarto the second embodiment, portions of the third embodiment that are thesame as the second embodiment are not repeatedly described herein. Theheat dissipation device in the third embodiment is different from thesecond one in that it is embodied as a loop heat pipe 5. In the thirdembodiment, a vapor chamber is a member serving as a primary fundamentalcarrier for forming the loop heat pipe 5 and is referred to as a/theheat dissipation device 3 herein. The heat dissipation device 3 includesan outlet 32 and an inlet 33. A vapor and liquid pipe 6 is extendedthrough a heat dissipation unit 7 and connected at two opposite ends tothe outlet 32 and the inlet 33. The vapor and liquid line 6, the heatdissipation unit 7, and the heat dissipation device 3 are structuresformed layer by layer through 3D printing. When forming the vapor andliquid line 6 layer by layer through 3D printing, different materialscan be selected and used alternately.

Please refer to FIG. 4, which is an assembled sectional view of a fourthembodiment of the heat dissipation device according to the presentinvention. Since the fourth embodiment is partially structurally similarto the second embodiment, portions of the fourth embodiment that are thesame as the second embodiment are not repeatedly described herein. Theheat dissipation device in the fourth embodiment is different from thesecond one in that it is externally provided on one side with apolymeric layer 34. The polymeric layer 34 can be formed using a naturalpolymer, a synthetic polymer or an inorganic polymer. The naturalpolymer can be any one of starch, rubber and nucleic acid. The syntheticpolymer can be any one of polyethylene (PE), polyvinyl chloride (PVC),nylon, Dacron (polyethylene terephthalate or PET), acrylonitrilebutadiene styrene (ABS), styrene-butadiene rubber (SBR), and otherhigh-molecular polymers. The inorganic polymer can be any one of quartz,asbestos, mica and graphite. These polymers can give the heatdissipation device 3 additional structural properties.

Please refer to FIGS. 5a to 5g , which are perspective views showing theforming of a fifth embodiment of the heat dissipation device accordingto the present invention. Since the fifth embodiment is partiallystructurally similar to the first embodiment, portions of the fifthembodiment that are the same as the first embodiment are not repeatedlydescribed herein. The heat dissipation device in the fifth embodiment isdifferent from the first one in that it is a complete heat dissipationdevice 3 constructed layer by layer through 3D printing, electrochemicalprocessing, injection, printing or thermal spraying. As shown in FIGS.5a and 5b , a first basic structural body 1 (i.e. a lower plate memberof a vapor chamber) is first formed through 3D printing. Then, as shownin FIG. 5c , a wick structure 2 is formed on one side surface of thefirst basic structural body 1 layer by layer through 3D printing.Finally, as shown in FIG. 5d , an integral structure including a firstbasic structure body 1 and a wick structure 2 is formed.

Please refer to FIG. 5e . Thereafter, any other remaining structuralportion for constructing the desired heat dissipation device 3, such asan upper plate member of the vapor chamber, is formed on one side of thefirst basic structural body 1 over the wick structure 2 layer by layerthrough 3D printing. Meanwhile, an airtight chamber 31 (see FIG. 2b ) isformed in the heat dissipation device 3, as shown in FIG. 5f . Finally,a complete heat dissipation device 3 is constructed, as shown in FIG. 5g.

Please refer to FIGS. 6a and 6b , which are perspective views showingthe forming of a sixth embodiment of the heat dissipation deviceaccording to the present invention. Since the sixth embodiment ispartially structurally similar to the first embodiment, portions of thesixth embodiment that are the same as the first embodiment are notrepeatedly described herein. The heat dissipation device in the sixthembodiment is different from the first one in that it is formed by firstproviding a pre-formed wick structure 2, as shown in FIG. 6a , and thenforming layer by layer a first basic structural body 1 (such as an upperor a lower plate member of a vapor chamber) on at least one side of thewick structure 2, or forming a heat dissipation device 3 (such as avapor chamber) on outer sides of the wick structure 2, as shown in FIG.6b . The heat dissipation device 3 shown in FIG. 6b can be formed layerby layer through 3D printing or electrochemical processing.

Please refer to FIGS. 7a and 7b , which are perspective views showingthe forming of a seventh embodiment of the heat dissipation deviceaccording to the present invention. Since the seventh embodiment ispartially structurally similar to the first embodiment, portions of theseventh embodiment that are the same as the first embodiment are notrepeatedly described herein. The heat dissipation device in the seventhembodiment is different from the first one in that it is constructed byfirst forming a completed first basic structural body 1 and a completedwick structure 2, as shown in FIG. 7a , and then a bonding layer 35 isformed between the first basic structural body 1 and the wick structure2, as shown in FIG. 7b . The bonding layer 35 can be formed through 3Dprinting, electrochemical processing, thermal spraying or printing. Withthe bonding layer 35, the first basic structural body 1 and the wickstructure 2 are bonded to each other to form an integral body.

Please refer to FIG. 8, which is an assembled perspective view of aneighth embodiment of the heat dissipation device according to thepresent invention. Since the eighth embodiment is partially structurallysimilar to the first embodiment, portions of the eighth embodiment thatare the same as the first embodiment are not repeatedly describedherein. The heat dissipation device in the eighth embodiment isdifferent from the first one in that it includes a first basicstructural body 1 (i.e. a lower or an upper plate member of a vaporchamber) having a wick structure 2 formed on one side surface thereofthrough 3D printing, electrochemical processing, injection, printing orthermal spraying. Thereafter, a frame section 8 capable of upgradingother structural properties of the first basic structural body 1 isfurther formed along a right and a left edge, along an upper and a loweredge, or along all four edges of the first basic structural body 1through 3D printing, electrochemical processing, injection, printing orthermal spraying.

The frame section 8 can be optionally formed of other materials showingdifferent structural properties, so that the frame section 8 can givethe first basic structural body 1 enhanced heat dissipation property orincreased structural strength. For example, the frame section 8 can beotherwise formed of a titanium alloy having good shape memory property,an aluminum material having good heat dissipation property, a coppermaterial having good heat absorption property, or graphite sheet orgraphene having excellent temperature evenness effect without beinglimited to any particular material. Other materials can also be selectedfor forming the frame section 8.

Please refer to FIGS. 9a and 9b , which are perspective and top views,respectively, of a ninth embodiment of the heat dissipation deviceaccording to the present invention. Since the ninth embodiment ispartially structurally similar to the fifth embodiment, portions of theninth embodiment that are the same as the fifth embodiment are notrepeatedly described herein. The heat dissipation device in the ninthembodiment is different from the fifth one in that it further includesan intermediate body 9 provided in the airtight chamber 31 defined inbetween two pieces of first basic structural bodies 1. In the ninthembodiment of the present invention, only the intermediate body 9 willbe described. The intermediate body 9 and the first basic structuralbodies 1 are integral structural bodies formed layer by layer.

The intermediate body 9 has a first side 91 and an opposite second side92, and is provided with a plurality of through holes 93 and a recessstructure 94. The recess structure 94 can be provided on any one or bothof the first side 91 and the second side 92. In the illustrated ninthembodiment, the recess structure 94 is provided on the first side 91.The through holes 93 are extended through the intermediate body 9 tocommunicate the first side 91 with the second side 92. The recessstructure 94 and the through holes 93 can be alternately arranged or noton the intermediate body 9. In the illustrated ninth embodiment, therecess structure 94 and the through holes 93 are alternately arranged onthe intermediate body 9. However, it is understood the arrangement ofthe recess structure 94 and the through holes 93 in the ninth embodimentis only illustrative and not intended to limit the present invention inany way.

As can be seen in FIG. 9b , the recess structure 94 includes a pluralityof spaced recesses 941, which are sunken from the first side 91 towardthe second side 92. The through holes 93 and the recesses 941 can behorizontally staggered in any two adjacent rows or columns, or bevertically superimposed. In the illustrated ninth embodiment, thethrough holes 93 and the recesses 941 are horizontally staggered in anytwo adjacent rows or columns, i.e. each of the through holes 93 islocated in an area between any two adjacent recesses 941. However, it isunderstood the arrangement of the recesses 94 a and the through holes 93in the ninth embodiment is only illustrative and not intended to limitthe present invention in any way. At least one connecting path 942 isprovided between two adjacent recesses 941 with two ends of theconnecting path 942 serially connected to the recesses 941, such thatthe recesses 941 are communicable with one another in both a transverseand a longitudinal direction.

Please refer to FIG. 9c , which is a sectional side view of a firstvariation of the ninth embodiment of the heat dissipation deviceaccording to the present invention. As shown, in this first variation,the heat dissipation device includes a wick structure 2 provided betweenthe first basic structural body 1 and the intermediate body 9. The wickstructure 2 can be a structural layer consisting of one single porousbody or a structural layer consisting of a plurality of superimposedporous bodies. The porous body can be a powder-sintered body, a wovenmesh, a fibrous member, or a structural body combining superimposedlayers of powder-sintered body, woven mesh and fibrous member.Alternatively, the porous body can include a plurality of grooves thatare formed between mutually spaced ribs. In the illustrated firstvariation of the ninth embodiment, the porous body is a woven mesh.However, it is understood the porous body in the form of a woven mesh inthe ninth embodiment is only illustrative and not intended to limit thepresent invention in any way.

Please refer to FIG. 9d , which is a sectional side view of a secondvariation of the ninth embodiment of the heat dissipation deviceaccording to the present invention. As shown, in this second variation,the intermediate body 9 further includes a plurality of supportingstructures 10, each of which is in the form of a post having two endsextended through and projected from the first side 91 and the secondside 92 of the intermediate body 9.

Please refer to FIG. 9e , which is a sectional side view of a thirdvariation of the ninth embodiment of the heat dissipation deviceaccording to the present invention. As shown, in this third variation,the intermediate body 9 further includes a plurality of supportingstructures 10, each of which includes a plurality of posts separatelylocated on the first side 91 and the second side 92 of the intermediatebody 9.

Please refer to FIGS. 10a and 10b , which are sectional side views of atenth embodiment of the heat dissipation device according to the presentinvention. Since the tenth embodiment is partially structurally similarto the fifth embodiment, portions of the tenth embodiment that are thesame as the fifth embodiment are not repeatedly described herein. Theheat dissipation device in the tenth embodiment is different from thefifth one in that it further includes at least one supporting structure10 located in the airtight chamber 31. The supporting structure 10 hasat least one end pressed against an inner wall surface of the airtightchamber 31. Further, the supporting structure 10 is an integralstructural body formed on the wick structure 2 layer by layer.

The supporting structure 10 in the tenth embodiment can be differentlyconfigured. As shown in FIG. 10a , the supporting structure 10 in afirst configuration thereof consists of a plurality of posts separatelyprojected from two opposite sides of the wick structure 2 to pressagainst inner wall surfaces of the airtight chamber 31.

As shown in FIG. 10b , the supporting structure 10 in a secondconfiguration thereof includes a single post that is extended throughthe wick structure 2 with two opposite ends pressed against inner wallsurfaces of the airtight chamber 31.

In either configuration, the supporting structure 10 is formed alongwith the first basic structural bodies 1 layer by layer to construct anintegral and complete heat dissipation device. In this manner, it isable to save the manufacturing cost that is required in the conventionalheat dissipation device for additional forming and processing twodifferent elements, i.e. the first basic structural bodies 1 and thesupporting structure 10. Therefore, the heat dissipation deviceaccording to the present invention can be manufactured at less time andlabor as well as reduced waste to largely lower the manufacturing costthereof.

For the wick structure 2, the first basic structural body 1 and thesupporting structure 10 that are not particularly described in some ofthe above-mentioned embodiments, they can be made of gold, silver,copper, aluminum, titanium, stainless steel, ceramic, plastic, or anycombination thereof. In the present invention, the wick structure 2 is astructural layer consisting of one single porous body or a plurality ofsuperimposed porous bodies. The porous body can be a powder-sinteredbody, a woven mesh, a fibrous member, or a structural body combiningsuperimposed layers of powder-sintered body, woven mesh and fibrousmember.

In summary, the present invention mainly provides a heat dissipationbasic structural body or a heat dissipation device, such as a vaporchamber, which is constructed layer by layer to complete an integralstructural body. More specifically, all the parts of the vapor chamber,including the external upper and lower plate members and the internalwick structure thereof, are sequentially formed layer by layer. Further,according to the present invention, materials of different propertiesare used and processed at the same time to embody a single structuralbody that presents more than one material property or characteristic, sothat a desired heat dissipation device can be manufactured in a moreflexible manner without being limited by mold design, which doubtlesslyincreases the entire manufacturing flexibility and reduces themanufacturing cost of the heat dissipation device.

The forming of an integral structural body of a desired heat dissipationdevice layer by layer as disclosed in the present invention breaksthrough the bottleneck in the conventional heat dissipation devicemanufacturing methods by using and processing materials of differentproperties, such as metal and non-metal materials, at the same time andenabling tight and flat attachment of the wick structure to the internalchamber of the heat dissipation device through easier and lesscomplicate processing procedures. The heat dissipation device having anintegral structural body constructed layer by layer according to thepresent invention can be more easily accomplished with simplifiedmanufacturing procedures while provides upgraded heat dissipationperformance and ensures the air-tightness of the internal chamber of theheat dissipation device.

In the case the heat dissipation device, i.e. the vapor chamber,constructed layer by layer according to the present invention ismanufactured in a vacuum environment, the device can not only haveimproved air-tightness, but also be formed without the need ofperforming an evacuation process. In this manner, more time and laborcosts can be saved, upgraded yield rate can be achieved, and internalvacuum tightness can be ensured in the vapor chamber manufacturingprocess.

FIG. 11 is a flowchart showing the steps included in a first embodimentof a method for manufacturing a heat dissipation device according to thepresent invention. Please refer to FIG. 11 along with FIGS. 1a to 1 d.As shown, the first embodiment of the method for manufacturing the heatdissipation device according to the present invention includes thefollowing steps:

S1: Forming a first basic structural body layer by layer forconstructing a desired heat dissipation device.

More specifically, in the first step S1, a first basic structural body 1for constructing a desired heat dissipation device 3 is formed layer bylayer. The first basic structural body 1 can be formed using stainlesssteel, copper, aluminum, titanium, ceramic, a titanium alloy,commercially pure titanium, or any non-metal material. Of course, thefirst basic structural body 1 can be otherwise formed using anycombination of the above-mentioned materials without being limited toany particular material. In the first embodiment of the method formanufacturing the heat dissipation device according to the presentinvention, the first basic structural body 1 is a lower plate member ofa vapor chamber. That is, in this first embodiment, the method formanufacturing the heat dissipation device begins from the forming of alower plate member for a vapor chamber.

The first basic structural body 1 for the heat dissipation device 3 canbe formed layer by layer through 3D printing, multi-material injectionmolding, thermal spraying, or printing. In this first embodiment, thefirst basic structural body 1 is illustratively and non-restrictivelyformed layer by layer through 3D printing (see FIGS. 1a and 1b ), andthe materials for forming the first basic structural body 1 can be in apowder form, in a half-melted form, or in a paste form, depending on thematerial properties of the selected materials.

S2: Forming a wick structure on one side surface of the first basicstructural body.

More specifically, in the second step S2, a wick structure 2 is formedon one side surface of the first basic structural body 1 also through 3Dprinting (see FIGS. 1c and 1d ). The wick structure 2 can be formedusing gold, silver, nickel, copper, aluminum, stainless steel, titanium,ceramic, or any combination thereof.

Please refer to FIG. 12, which is a flowchart showing the steps includedin a second embodiment of the method for manufacturing the heatdissipation device according to the present invention. These steps aredescribed in detail below.

S1: Forming a first basic structural body layer by layer forconstructing a desired heat dissipation device.

S2: Forming a wick structure on one side surface of the first basicstructural body.

Since the above two steps S1 and S2 are the same as those in the firstembodiment of the method for manufacturing the heat dissipation deviceaccording to the present invention, they are not repeatedly describedherein. The second embodiment is different from the first one in furtherincluding the following steps S3 and S4.

S3: Correspondingly closing together a pair of the completed first basicstructural bodies that have the wick structure formed on one inner sidesurface thereof and sealing joints between the two first basicstructural bodies to construct the desired heat dissipation device thathas an airtight chamber defined therein.

More specifically, in the third step S3, a pair of the first structuralbodies 1 that have the wick structure 2 formed on one inner side surfacethereof are correspondingly closed together and joints between them aresealed, so that an airtight chamber 31 is defined between the two closedfirst basic structural bodies 1 to construct a complete heat dissipationdevice 3 (see FIGS. 2a to 2d ). The joint sealing can be performedthrough laser processing, diffusion bonding or welding.

S4: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S3.

More specifically, in the fourth step S4, after the joints between thepair of first basic structural bodies 1 are sealed, air is evacuatedfrom the airtight chamber 31 of the heat dissipation device 3 and aworking fluid 4 is filled into the airtight chamber 31. Finally, theheat dissipation device 3 is completely sealed.

FIG. 13 is a flowchart showing the steps included in a third embodimentof the method for manufacturing the heat dissipation device according tothe present invention. These steps are described in detail below byreference to FIG. 13 along with FIGS. 6a and 6 b.

S1: Providing a wick structure and forming layer by layer a desired heatdissipation device outside the wick structure, so that the heatdissipation device has an airtight chamber defined therein.

More specifically, in the first step S1, a pre-formed wick structure 2is provided (see FIG. 6a ). Then, a first basic structural body 1 (i.e.an upper or a lower plate member of a vapor chamber) is formed on atleast one side of the wick structure 2 layer by layer, or a heatdissipation device 3 (such as a vapor chamber) is externally formed onouter sides of the wick structure 2 (see FIG. 6b ). In this thirdembodiment, a heat dissipation device 3 in the form of a vapor chamberis constructed. The material for forming the heat dissipation device 3can be stainless steel, copper, aluminum, titanium, ceramic, or anycombination thereof without being particularly limited.

According to the present invention, the heat dissipation device 3 isconstructed layer by layer through 3D printing, multi-material injectionmolding, thermal spraying, printing, or electrochemical processing. Inthis third embodiment, the forming of the heat dissipation device 3layer by layer is illustratively and non-restrictively achieved through3D printing. Further, the materials for forming the heat dissipationdevice 3 can be in a powder form, in a half-melted form, or in a pasteform, depending on the material properties of the selected materials.

S2: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S1.

More specifically, in the second step S2, after the heat dissipationdevice 3 is fully constructed, air in an airtight chamber 31 defined inthe heat dissipation device 3 is evacuated from and a working fluid 4 isfilled into the airtight chamber 31, all via a pre-reserved hole on theheat dissipation device 3. Finally, the pre-reserved hole on the heatdissipation device 3 is sealed.

FIG. 14 is a flowchart showing the steps included in a fourth embodimentof the method for manufacturing the heat dissipation device according tothe present invention. These steps are described in detail below byreference to FIG. 14 along with FIG. 8.

S1: Providing a wick structure and forming layer by layer a desired heatdissipation device outside the wick structure, so that the heatdissipation device has an airtight chamber defined therein.

S2: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S1.

Since the above steps S1 and S2 are the same as those in the thirdembodiment of the method for manufacturing the heat dissipation deviceaccording to the present invention, they are not repeatedly describedherein. The third embodiment is different from the third one in furtherincluding the following step S3 after the second step S2.

S3: Forming an additional structure step by step on an outer side of theheat dissipation device using a material the same as or different fromthat of the heat dissipation device.

More specifically, in the third step S3, an additional structure capableof upgrading other structural properties of the heat dissipation device3 is formed step by step on an outer side of the heat dissipation device3, for example, along a right and a left edge, along an upper and alower edge, or along all four edges of the heat dissipation device 3.The additional structure can be integrally formed with the heatdissipation device 3 using, for example, a titanium alloy having goodshape memory property, an aluminum alloy capable of providing enhancedstructural strength, or a polymeric material showing good ductility.And, the additional structure can be formed step by step throughinjection, electroplating, electrolysis, 3D printing, printing, orthermal spraying without being limited to any particular process.

Please refer to FIG. 15, which is a flowchart showing the steps includedin a fifth embodiment of the method for manufacturing the heatdissipation device according to the present invention. These steps aredescribed below by reference to FIG. 15 along with FIGS. 5a to 5 g.

S1: Forming a first basic structural body and a wick structure layer bylayer for constructing a desired heat dissipation device.

More specifically, in the first step S1, a first basic structural body 1and a wick structure 2 for constructing a desired heat dissipationdevice 3 are formed layer by layer (see FIGS. 5a and 5b ). The firstbasic structural body 1 can be formed using stainless steel, copper,aluminum, titanium, or ceramic, or any combination thereof. The firstbasic structural body 1 can be a lower plate member of a vapor chamber.The first basic structural body 1 can be formed layer by layer through3D printing, injection, printing, or thermal spraying. In this fifthembodiment, the first basic structural body 1 is illustratively andnon-restrictively formed layer by layer through 3D printing.

Then, a wick structure 2 is formed on one side surface of the firstbasic structural body 1 (see FIG. 5c ) layer by layer also through 3Dprinting Finally, an integral structure including a first basicstructure body 1 and a wick structure 2 is formed (see FIG. 5d ).

S2: Forming step by step all remaining structural portions forconstructing the desired heat dissipation device.

More specifically, in the second step S2, all remaining structuralportions for constructing the desired heat dissipation device 3, such asan upper plate member of the vapor chamber, are further formed over thefirst basic structural body 1 layer by layer through 3D printing (seeFIG. 5e ), such that an airtight chamber 31 is formed between the firstbasic structural body 1 and the sequentially completed remainingstructural portions (see FIGS. 2b and 5f ). Finally, a complete heatdissipation device 3 is formed, as shown in FIG. 5 g.

In the fifth embodiment of the method for manufacturing the heatdissipation device according to the present invention, the forming ofthe heat dissipation device 3 layer by layer can be completed fasterthrough a multiple mirroring technique. That is, the heat dissipationdevice 3 or the first basic structural body 1 to be formed layer bylayer can be divided into a left and a right part or an upper and alower part, and the layer-by-layer forming process can be performed onthese parts synchronously or asynchronously. By dividing the heatdissipation device 3 or the first basic structural body 1 to be formedinto several equally divided parts and performing the layer-by-layerforming on these equally divided parts from one direction, twodirections or multiple directions, the layer-by-layer forming processcan be completed within a shortened time. Mirroring division of astructural body to be formed can be achieved by dividing the structuralbody into several symmetrical parts or asymmetrical parts. By performingthe layer-by-layer forming process on multiple mirroring parts of thestructural body to be formed, the time required by the entiremanufacturing process can be shortened to reduce time and labor costs.

S3: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S2.

More specifically, in the third step S3, after the heat dissipationdevice 3 is fully constructed, air in an airtight chamber 31 defined inthe heat dissipation device 3 is evacuated and a working fluid 4 isfilled into the airtight chamber 31. Finally, the heat dissipationdevice 3 is completely sealed.

In the case the fifth embodiment of the method for manufacturing theheat dissipation device according to the present invention is performedin a vacuum environment, the working fluid filling and final sealingprocesses can be performed in the second step S2 to complete the heatdissipation device 3, and the third step S3 can be omitted, accordingly.

FIG. 16 is a flowchart showing the steps included in a sixth embodimentof the method for manufacturing the heat dissipation device according tothe present invention. These steps are described below by reference toFIG. 16 along with FIG. 7.

S1: Providing a fundamental member (i.e. a first basic structural body)for constructing a desired heat dissipation device and providing asingle body of wick structure, and placing the single body of wickstructure on one side surface of the fundamental member.

More specifically, in the first step S1, a fundamental member forconstructing a desired heat dissipation device 3 is provided. In thissixth embodiment of the method for manufacturing the heat dissipationdevice according to the present invention, the fundamental member refersto a first basic structural body 1 (i.e. a lower plate member for avapor chamber).

The material for forming the single body of wick structure 2 can becopper, aluminum, nickel, gold, silver, titanium, stainless steel orceramic, or any combination thereof. Further, the single body of wickstructure 2 can be a powder-sintered body, a woven mesh, a fibrousmember, or a plurality of grooves. In this sixth embodiment of themethod for manufacturing the heat dissipation device according to thepresent invention, the single body of wick structure 2 is illustrativelyand non-restrictively shown as a powder-sintered body.

S2: Forming a bonding layer to bond the single body of wick structureand the first basic structural body together to obtain an integral body;and then forming step by step all remaining structural portions forconstructing the desired heat dissipation device.

More specifically, in the second step S2, after the single body of wickstructure 2 is placed on one side surface of the first basic structuralbody 1, a bonding layer 35 is formed between joints of the wickstructure 2 and the first basic structural body 1 throughelectrochemical processing, so that the first basic structural body 1and the wick structure 2 are bonded together to form an integral body(see FIG. 7). Thereafter, other remaining structural portions forconstructing the desired heat dissipation device 3, such as the upperplate member for the vapor chamber, are formed step by step on an upperside of the first basic structural body 1 to complete the desired heatdissipation device 3 that internally defines an airtight chamber 31.

S3: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S2.

More specifically, in the third step S3, after the heat dissipationdevice 3 is fully constructed, air in the airtight chamber 31 defined inthe heat dissipation device 3 is evacuated from and a working fluid 4 isfilled into the airtight chamber 31, all via a pre-reserved hole on theheat dissipation device 3. Finally, the pre-reserved hole on the heatdissipation device 3 is sealed.

FIG. 17 is a flowchart showing the steps included in a seventhembodiment of the method for manufacturing the heat dissipation deviceaccording to the present invention. These steps are described in detailbelow by reference to FIG. 17 along with FIG. 8.

S1: Providing a first basic structural body for constructing a desiredheat dissipation device and then forming a wick structure on one sidesurface of the first basic structural body.

More specifically, in the first step S1, a pre-formed first basicstructural body 1 such as a lower plate member of a vapor chamber isprovided, and a wick structure 2 is formed on an inner side surface ofthe first basic structural body 1 through 3D printing, electrochemicalprocessing, injection, printing, or thermal spraying.

S2: Forming a frame section at other areas outside the first basicstructural body.

More specifically, in the second step S2, a frame section 8 capable ofupgrading other structural properties of the first basic structural body1 is further formed along a right and a left edge, along an upper and alower edge, or along all four edges of the first basic structural body 1through 3D printing, electrochemical processing, injection, printing, orthermal spraying.

The frame section 8 can be optionally formed of other materials showingdifferent structural properties, so that the frame section 8 can givethe first basic structural body 1 enhanced heat dissipation property orincreased structural strength. For example, the frame section 8 can beotherwise formed of a titanium alloy having good shape memory property,an aluminum material having good heat dissipation property, or graphitesheet or graphene having excellent temperature evenness effect withoutbeing limited to any particular material. Other materials can also beselected for forming the frame section 8.

Please refer to FIG. 18, which is a flowchart showing the steps includedin an eighth embodiment of the method for manufacturing the heatdissipation device according to the present invention. These steps aredescribed below by reference to FIG. 18 along with FIGS. 9a to 9c , inwhich the ninth embodiment of the heat dissipation device according tothe present invention is illustrated.

S1: Forming a first basic structural body layer by layer forconstructing a desired heat dissipation device.

Since the first step S1 in this eighth embodiment is similar to thefirst step S1 in the first and the second embodiment of the method formanufacturing the heat dissipation device according to the presentinvention, it is not repeatedly described herein.

S2: Forming an intermediate body on one side surface of the first basicstructural body.

More specifically, in the second step S2, an intermediate body 9 isformed on one side surface of the first basic structural body 1 (seeFIGS. 9a and 9b ). The intermediate body 9 can be similarly formedthrough 3D printing, and the material for forming the intermediate body9 can be copper, aluminum, stainless steel, titanium, or ceramic, or anycombination thereof.

S3: Forming step by step all remaining structural portions forconstructing the desired heat dissipation device that has an airtightchamber defined therein.

S4: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S3.

In the eighth embodiment of the method for manufacturing the heatdissipation device according to the present invention, the heatdissipation device can be otherwise constructed layer by layer throughelectrochemical processing. The electrochemical processing can beelectroplating, electroless plating, electroforming, or electrolysis.

The material selected for using in the electrochemical processing can becopper, aluminum, nickel, titanium or ceramic, or any combinationthereof.

In the above-mentioned embodiments of the method for manufacturing theheat dissipation device according to the present invention, the wickstructure 2 can be otherwise formed through a chemical vapor depositionprocess or a physical vapor deposition process and is then subjected topickling to form a porous wick structure 2.

The wick structure 2 can be formed using gold, silver, copper, aluminum,stainless steel or titanium, or any combination thereof. And, the wickstructure 2 can be in the form of a mesh structure, a plurality ofgrooves, or a porous structure.

In the case of electroforming, it applies the same electrochemicalprinciple as that being applied by general metal electroplating, i.e. aprocess of electrodeposition, which uses an externally supplied electricenergy to cause a mixed solution containing metal ions and otheradditives to produce an electrochemical oxidation-reduction reaction onsurfaces of a cathode and an anode, so that a desired metal is depositedon a prototype. In an electrochemical reaction, metal cations in asolution are driven by an externally supplied electric energy to movetoward the cathode, and a metal coating is deposited on surfaces of aworkpiece through a reduction reaction. Therefore, in the commonly usedelectroplating and precision electroforming processes, an object to beplated or a prototype is used as the cathode. According to the presentinvention, after the heat dissipation device 3 is formed, it is used asa cathode in the electroplating or the electroforming process and adesired metal is deposited on the cathode at positions where the wickstructure 2 is to be formed.

In electroplating and electroforming, they apply the same principle todeposit a metal material on a specially designed female mold. Variousmetal materials can be selected for use in these electrochemicalprocesses. When the deposited metal material reaches a desiredthickness, the deposited metal material is separated from the femalemold to provide an electroformed workpiece. According to the method ofthe present invention, a frame member is first provided for using in theelectroforming or the electroplating process. When the electroforming orthe electroplating process is completed, the frame member is removedfrom the deposited metal material to obtain the workpiece so formed. Inthe present invention, the frame member for this purpose has aconfiguration generally the same as the upper and the lower plate memberof a vapor chamber to be formed. In the electroplating or theelectroforming process, the metal material is molded and attached to thesurfaces of the frame member.

The steps included in the above-described embodiments of the method formanufacturing the heat dissipation device according to the presentinvention can be optionally performed in a vacuum environment. In thecase of performing the method of the present invention in a vacuumenvironment, the step of evacuating air from the airtight chamber 31 ofthe heat dissipation device 3 can be omitted.

Please refer to FIG. 19, which is a flowchart showing the steps includedin a ninth embodiment of the method for manufacturing the heatdissipation device according to the present invention. These steps aredescribed below by reference to FIG. 19 along with FIGS. 21a to 21d and22a to 22 d.

S1: Providing a fundamental member (i.e. a first basic structural body)for constructing a desired heat dissipation device.

More specifically, in the first step S1, a fundamental member forforming a desired heat dissipation device 3 is provided. In this ninthembodiment of the method for manufacturing the heat dissipation deviceaccording to the present invention, the fundamental member refers to afirst basic structural body 1, which can be a lower or an upper platemember of a vapor chamber.

S2: Forming a wick structure on one side surface of the first basicstructural body and forming all remaining structural portions forconstructing the desired heat dissipation heat through electrochemicalprocessing.

More specifically, in the second step S2, electrochemical processing isused to form a wick structure 2 on a selected side surface of the firstbasic structural body 1, which is a lower plate member of the vaporchamber in this ninth embodiment. Thereafter, all remaining structuralportions for constructing the desired heat dissipation device 3, such asan upper plate member of the vapor chamber, are formed at the same time,so as to complete the desired heat dissipation device 3 that internallydefines an airtight chamber 31 (not shown).

The electrochemical processing can be electroplating, electrolessplating, electroforming, or electrolysis. The material selected forforming the wick structure 2 through electrochemical processing can becopper, aluminum, nickel, titanium or ceramic, or any combinationthereof. In the case of using electrochemical processing to form thewick structure 2 of the heat dissipation device 3 of the presentinvention, a modeling frame is first disposed on a location at where theelectrochemical processing is to be performed, so that the wickstructure 2 is formed in areas that are not covered by the modelingframe. The modeling frame can be a solid frame, a piece of sticker, or athin layer formed through printing, and is used to cover areas that arenot to be provided with the wick structure 2. When the deposition of thewick structure 2 is completed, the modeling frame is removed.

S3: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S2.

More specifically, in the third step S3, after the heat dissipationdevice 3 is fully constructed, that is, after a lower and an upper platemember are closed together to provide a vapor chamber, air in anairtight chamber 31 defined in the heat dissipation device 3 isevacuated from and a working fluid 4 is filled into the airtight chamber31, all via a pre-reserved hole on the heat dissipation device 3.Finally, the pre-reserved hole on the heat dissipation device 3 issealed. Since the heat dissipation device 3 constructed layer by layeraccording to the present invention is an integral structure, the processof sealing joints can be saved to largely reduce the manufacturing costand yield loss while avoid the problem of air leakage from thevacuum-tight heat dissipation device 3.

In addition, in the case the steps included in the ninth embodiment ofthe method for manufacturing the heat dissipation device according tothe present invention are performed in a vacuum environment, the processof evacuation can be omitted, accordingly.

Please refer to FIG. 20, which is a flowchart showing the steps includedin a tenth embodiment of the method for manufacturing the heatdissipation device according to the present invention. These steps aredescribed below.

S1: Forming a first basic structural body and a wick structure layer bylayer through electrochemical processing for constructing a heatdissipation device.

More specifically, in the first step S1, a first basic structural body 1and a wick structure 2 for constructing a desired heat dissipationdevice 3 are formed layer by layer through electrochemical processing.The first basic structural body 1 can be formed using stainless steel,copper, aluminum or titanium, or any combination thereof. The firstbasic structural body 1 can be a lower or an upper plate member of avapor chamber, or an integral body of a vapor chamber. Theelectrochemical processing can be electroplating, electroless plating,electroforming or electrolysis.

The wick structure 2 can be formed using copper, aluminum, stainlesssteel or titanium, or any combination thereof. The wick structure 2 canbe in the form of a mesh structure, a plurality of grooves, or a porousstructure.

S2: Forming step by step all remaining structural portions forconstructing the desired heat dissipation device.

More specifically, in the second step S2, after the first basicstructural body 1 (which is a lower plate member of a vapor chamber inthis embodiment) and the wick structure 2 are formed, other remainingstructural portions for completing the desired heat dissipation device3, such as an upper plate member of the vapor chamber, are formed stepby step on an upper side of the first basic structural body 1 throughelectrochemical processing to complete the desired heat dissipationdevice 3.

S3: Performing evacuation, working fluid filling and final sealingprocesses for the heat dissipation device constructed in S2.

More specifically, in the third step S3, after the heat dissipationdevice 3 is fully constructed, air in the airtight chamber 31 defined inthe heat dissipation device 3 is evacuated from and a working fluid 4 isfilled into the airtight chamber 31. Finally, the heat dissipationdevice 3 is fully sealed.

All the steps included in the above-mentioned embodiments of the methodfor manufacturing the heat dissipation device according to the presentinvention can be optionally performed in a vacuum environment. In thecase of performing the method of the present invention in a vacuumenvironment, the step of evacuating air from the airtight chamber 31 ofthe heat dissipation device 3 can be omitted.

With the method for manufacturing the heat dissipation device accordingto the present invention, different types of materials can be freelyselected for use at the same time to manufacture an integrally formedheat dissipation device. In this manner, the flexibility in selectingmaterials for forming the heat dissipation device is increased. Further,the use of materials of different properties or characteristics allowsthe manufacturing of heat dissipation devices of different structuralproperties or characteristics. For example, a heat dissipation devicehaving a flexible, shape-changeable structural body can be obtained byforming it using a flexible material; or, a heat dissipation devicehaving a structural body that is elastically deformable under anexternal force and elastically restorable when the external force isremoved can be obtained by forming it using a material having good shapememory property, such as a titanium alloy. Therefore, the presentinvention not only enables increased flexibility in the design andmanufacturing of the structural body of the heat dissipation device, butalso avoids unnecessary processing procedures (such as cutting),pollution caused by welding, and increased cost due to waste disposal.

The present invention has been described with some preferred embodimentsthereof and it is understood that many changes and modifications in thedescribed embodiments can be carried out without departing from thescope and the spirit of the invention that is intended to be limitedonly by the appended claims.

What is claimed is:
 1. A method for manufacturing a heat dissipationdevice, comprising the following steps: forming a first basic structuralbody layer by layer for constructing a heat dissipation device; forminga wick structure on one side surface of the first basic structural bodyand forming all remaining structural portions for constructing the heatdissipation device; and performing evacuation, working fluid filling andfinal sealing processes for the constructed heat dissipation device. 2.The method for manufacturing the heat dissipation device as claimed inclaim 1, wherein the first basic structural body is formed using amaterial selected from the group consisting of stainless steel, copper,aluminum, titanium, ceramic, titanium alloys, commercially puretitanium, and non-metal materials.
 3. The method for manufacturing theheat dissipation device as claimed in claim 1, wherein the first basicstructural body for constructing the heat dissipation device is formedlayer by layer through a manner selected from the group consisting of 3Dprinting, multi-material injection molding, thermal spraying, printing,and electrochemical processing.
 4. The method for manufacturing the heatdissipation device as claimed in claim 1, wherein the first basicstructural body is formed layer by layer using materials in a formselected from the group consisting of a powder form, a half-melted form,or a paste form.
 5. The method for manufacturing the heat dissipationdevice as claimed in claim 1, wherein the wick structure is formed usinga material selected from the group consisting of copper, aluminum,nickel, gold, silver, titanium, stainless steel, ceramic, and anycombination thereof.
 6. The method for manufacturing the heatdissipation device as claimed in claim 1, wherein the wick structure isin a form selected from the group consisting of a powder-sintered body,a woven mesh, a fibrous member, and a plurality of grooves.
 7. Themethod for manufacturing the heat dissipation device as claimed in claim3, wherein the electrochemical processing is selected from the groupconsisting of electroplating, electroless plating, electroforming, andelectrolysis.
 8. The method for manufacturing the heat dissipationdevice as claimed in claim 7, wherein the electrochemical processing isperformed using a material selected from the group consisting of copper,aluminum, nickel, gold, silver, and ceramic.